Applying thermal compound is a must because the contact surfaces are not perfectly even and smooth even brand new cpus and heat sinks have surface imperfections and microscopic scratches that traps pockets of air.
Heat sink compound types.
For effective transfer of heat between components heat sinks will not dry or harden white past.
For mounting transistors diodes rectifiers and resistors.
For effective transfer of heat between components heat sinks will not dry or harden white paste.
Super lube silicone heat sink 3 oz.
Silicone base extra high efficiency heat transfer.
More buying choices 32 99 8 new offers thermal paste 5 pack thermalcoolflux tm high performance polysynthetic silver thermal paste.
Silicone compound blended with thermally conductive fine metal oxide powders.
In order to choose the correct heat sink for cooling electronic applications it s useful for engineers to understand the definitions uses and benefits of different types of heat sinks.
Zinc oxide compounds create a more secure bond than silicone compounds.
Since air is one of the worst thermal conductors on earth it will impede the heat sink s ability to lower the cpu temperature.
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Here are some guidelines for the types of heat sinks that are commonly used in conjunction with heat pipes and vapor chambers.
In computers heat sinks are used to cool cpus gpus and some chipsets and ram modules.
1446622 silicone heat sink compound lubricant grease 5 oz 140 g tube.
Will not harden or melt.
Silicone base extra high efficiency heat transfer.
Type z9 1 fluid ounce.
Will not react to rubber or plastic.
Type z9 1 fluid ounce.
Bond heat sinks to surfaces eliminating air gaps for maximum heat transfer.
Excellent heat transfer efficiency.
Thermal joint compound for any device where efficient cooling is desired.
A heat sink also commonly spelled heatsink is a passive heat exchanger that transfers the heat generated by an electronic or a mechanical device to a fluid medium often air or a liquid coolant where it is dissipated away from the device thereby allowing regulation of the device s temperature.
Temperature range from 45 degrees f to 500 degrees f.
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Thermal joint compound for any device where efficient cooling is desired.